TTTech to lead talk on integrated modular avionics, advanced system integration at Avionics Europe

MUNICH, 11 Jan. 2013. Dr. Mirko Jakovljevic of TTTech in Vienna, Austria, will present a paper, entitled “Integrated Modular Avionics (IMA) and Advanced System Integration for Future Aerospace Systems,” during Avionics Europe 2013.  

New, advanced integrated architectures and IMA can be designed to reduce electronic control unit (ECU) cost, minimize the number of control units, and minimize wiring and weight, says Dr. Jakovljevic. Higher levels of functional integration enable system optimization and improved aircraft performance, but may also add more effort in system integration.

Advanced system integration, as the lowest (networking) platform layer, plays essential role in the process of IMA platform design. Minor differences in capabilities at this level can significantly influence the complete system architecture and lifecycle. For example, says Dr. Jakovljevic, “time-triggered networking capabilities can have far-reaching consequences on embedded system virtualization and the optimization of avionics architectures.”

Advanced system integration based on ARINC664 can help to design open IMA architectures, and SWaP-optimized rotorcraft and aircraft systems. In his paper, Dr. Jakovljevic will discuss how time-triggered capabilities implanted on standard ARINC664 (AFDX) networks contribute to design of fault-tolerant distributed embedded computing platforms.

Dr. Mirko Jakovljevic specializes in advanced integrated systems, distributed embedded platforms for time-, safety-, and mission-critical applications, system design methodology, certification, complexity management, and standardization of new technologies in the aerospace domain.

Follow Avionics Intelligence news updates on Twitter (@Avionics_Intel), LinkedIn, and Google+.

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account.

Related Products

RR2P Removable Canister RAID System

Transportable data storage for mobile field use aboard planes, ships and ground transpo...

API DC Link Power Film Capacitors

High reliability DC link capacitors for power inverter applications which require super...


Master Bond’s silicones are available in both one part and two part versions that offer...

Related Companies

Innovative Integration

  Since 1988, Innovative Integration has grown to become one of the world's leading supplier...

Winchester Systems Inc

At its founding in 1981, Winchester Systems introduced its first 5 MB disk system for Intel devel...

API Technologies Corp

Who We Are API Technologies is a dominant technology provider of RF/microwave, microelectronics, ...

Most Popular Articles

Wire News provided by   


All Access Sponsors

Follow Us On...