Small-form-factor rugged computer for aerospace and defense signal processing introduced by X-ES
Extreme Engineering Solutions Inc. (X-ES) in Verona, Wis., is introducing the XPand6215 commercial-off-the-shelf (COTS) rugged computer system for a wide range of signal processing applications.
By Intelligent Aerospace staff
VERONA, Wis. – Extreme Engineering Solutions Inc. (X-ES) in Verona, Wis., is introducing the XPand6215 commercial-off-the-shelf (COTS) rugged computer system for a wide range of signal processing applications.
Based on the Intel Xeon D-1500 family of processors and the Xilinx Kintex Ultrascale FPGA, the XPand6215 offers several high-speed fiber-optic interfaces on the front panel.
With a compact design, the XPand6215 makes the most of processing and networking performance while minimizing size, weight, power, and power consumption (SWaP).
It is a small-form-factor (SFF) system with one 3U VPX Intel Xeon D single-board computer hosting a 10 Gigabit Ethernet Switched Mezzanine Card (XMC) networking module and one 3U VPX Xilinx Kintex Ultrascale field-programmable gate array (FPGA) module with FireFly connectors.
In the first slot, the XPedite7670 single-board computer has an Intel Xeon D-1500 processor that has as many as 16 Xeon-class cores in one, power-efficient system-on-chip. The XPedite7670 hosts an XPort3305 10 Gigabit Ethernet XMC module, which provides a 10GBASE-SR Ethernet port through a fiber-optic connector on the XPand6215 front panel.
Eight lanes of PCI Express Gen3 connect the XPedite7670 to the XPedite2570 in the second slot to facilitate signal processing. This reconfigurable FPGA processing module is based on the Xilinx Kintex Ultrascale XCKU115 FPGA. The XPedite2570 provides 12 high-data-rate, protocol-independent fiber-optic transmitters and receivers, accessible through a second fiber connector on the XPand6215 front panel.
This rugged system is designed to meet MIL-STD-810 and DO-160, while integrating power-saving and performance-enhancing technology. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by convection cooling and to an attached cold plate by conduction cooling.
The system includes an integrated 28-volt DC power supply and MIL-STD-461 EMI filtering. For more information contact X-ES online at www.xes-inc.com.
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