Teledyne e2v completes first multi-chip-module assembly on organic flip-chip

CHELMSFORD, United Kingdom - Teledyne e2v, an aerospace qualified manufacturer of advanced semiconductors, announced last month that it has completed the assembly of its first Multi-Chip-Module (MCM) on organic substrate.

Dec 10th, 2018
Teledyne e2v completes first multi-chip-module assembly on organic flip-chip
Teledyne e2v completes first multi-chip-module assembly on organic flip-chip
CHELMSFORD, United Kingdom -Teledyne e2v, an aerospace qualified manufacturer of advanced semiconductors, announced last month that it has completed the assembly of its first Multi-Chip-Module (MCM) on organic substrate.

After the successful completion of the QML-Y certification, being the sole manufacturer to have obtained as of today this certification in Europe, Teledyne e2v is pursuing its roadmap to address high end, high reliability markets with state-of-the-art components. The module uses five dies assembled in flip-chip.

Evelyne Tur, General Manager of the Integrated Microelectronics Solutions business unit comments: “We are very proud of this achievement, which is a great step forward in our roadmap to supply the space and aeronautics industry with leading edge, high reliability products using organic flip-chip assembly techniques. It shows our commitment to supply the European space industry with long term solutions for high end, demanding devices. These developments will serve both our external and internal customers and will help to strengthen our offering with more competitive solutions."

Nicolas Chantier, Marketing Director for conversion products, adds: “We are very happy to have the in-house capability to develop our future data conversion modules, based on our state-of-the art analog-to-digital and digital-to-analog converters. We see a high demand in the future for this kind of products, whether this is for space, aerospace or defense."

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