HARRISBURG, Pa., 16 March 2016.TE Connectivity Ltd. (NYSE:TEL), provider of connectivity and sensors, is introducing its DMC-M high-density 30-23 modules for aerospace applications, including next-generation aircraft.
“TE understands the challenges that next-generation aircraft design poses, and we are focused on continually developing new designs that save space and weight,” says Christian Cavailles, product manager, Global Aerospace, Defense & Marine, TE. “Not only have the new inserts been designed to solve the issue of fragile contact pins being bent upon blind mating, but out of the full product line they provide the highest density system in an extremely small area.”
The high-density modules are ideal for applications such as: in-flight entertainment and cabin systems, high-speed Internet access, lighting and window dimming, power distribution and control, and electrical wiring and interconnect systems.
The increased density of the new 30-position modules provides a 50 percent increase in contact counts over the existing 20-22 modules, allowing two 30-23 modules to provide the same 60-contact density as three 20-22 modules – reducing the connector and harness sizes, enabling space and weight savings.
TE’s plastic clip technology provides additional weight savings and simplifies the assembly process, providing possible weight savings of up to 20 percent.
Designed for EN4165, BACC65, and ARINC 809 shells, the modules achieve higher density with a reverse design that protects against damage due to exposed contacts.
TE Connectivity (NYSE:TEL), a $12 billion global technology provider of connectivity and sensor solutions, collaborates with engineers to transform their concepts into creations – redefining what’s possible using intelligent, efficient, and high-performing TE products and solutions proven in harsh environments. Our 72,000 people, including over 7,000 engineers, partner with customers in close to 150 countries across a wide range of industries.
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