Rugged COM embedded computing module for avionics applications introduced by MEN Micro

AMBLER, Pa. 2 Feb. 2012. MEN Micro Inc. in Ambler, Pa., is introducing the semi-custom MM2 small computer-on-module (COM) with an application-specific carrier board and upgraded processor for use in industrial, harsh, mobile, and mission-critical environments in applications such as avionics, railway, agricultural and construction machines, medical engineering, and industrial automation.

Feb 2nd, 2012
Rugged COM embedded computing module for avionics applications introduced by MEN Micro
Rugged COM embedded computing module for avionics applications introduced by MEN Micro

AMBLER, Pa. 2 Feb. 2012. MEN Micro Inc. in Ambler, Pa., is introducing the semi-custom MM2 small computer-on-module (COM) with an application-specific carrier board and upgraded processor for use in industrial, harsh, mobile, and mission-critical environments in applications such as avionics, railway, agricultural and construction machines, medical engineering, and industrial automation.

The MM2 embedded computing module measures 95 by 55 millimeters, features the Intel Atom E600 series processor, and an EMC-proof enclosure. The Intel Atom processor offers a frequency to 1.6 GHz, total power consumption of five to seven Watts, and PCI Express I/O for the processor-to-chip interface.

The board operates in temperatures from -40 to 85 degrees Celsius, and supports serial and legacy I/O. The board offers two PCI Express x1 links, LVDS, and SDVO for graphic interfaces as well as high definition audio, Ethernet, SATA, USB, two I2C, CAN bus, and COM interfaces.

The MM2 module can accommodate as much as 2 gigabytes of DDR2 SDRAM of directly soldered main memory with mass storage media supported on the carrier board. Each processor includes 512 kilobytes of L2 cache, and comes with a real-time clock and board management controller for temperature and power supervision.

High-pressure screw connections between the housing and carrier board facilitate thermal connection of components. The housing can connect to an external conduction-cooled system or combined with a heat sink on the top cover for convection cooling. The low-power version may operate without the frame and cover in moderate application temperatures.

The module comes equipped with rugged, industry-proven connectors supporting high frequency and differential signal connections. Conformal coating is available on request. For more information contact MEN Micro online at www.men.de.

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