BAE Systems, Raytheon to develop optical interconnects to enhance system connectivity in embedded computing

Jul 9th, 2019
Optical Interconnects 9 July 2019 5d24835eaf661
ARLINGTON, Va. – U.S. military researchers are spending about $1.2 million with two U.S. military prime contractors to find ways of using optical interconnects on high-performance embedded computing boards to enhance bandwidth, power efficiency, channel density, and link reach, writes John Keller for Military & Aerospace Electronics. Continue reading original article

The Intelligent Aerospace take:

July 9, 2019-DARPA researchers are trying to find improvements by reducing signaling energy and latency, while increasing overall signaling capacity and component density. This is where the PIPES project comes in.

Developing efficient, high-bandwidth, package-level photonic signaling should have substantial influence on high-performance computing, on big-data applications that use machine learning, advanced sensors, and wireless interfaces.

While optical signaling is common today in such systems at the board and rack levels, it has not yet been integrated within component switch chips, central processing units (CPUs), and graphical processing units (GPUs).

Related: DARPA awards BAE Systems contract to further develop autonomous software for air mission planning

Related: Interface Concept chooses optical interconnects from Reflex Photonics for VPX embedded computing boards

Related: Solderless press-fit receptacles for circuit board interconnects introduced by Mill-Max

Jamie Whitney, Associate Editor
Intelligent Aerospace

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