BAE Systems, Raytheon to develop optical interconnects to enhance system connectivity in embedded computing
The Intelligent Aerospace take:
July 9, 2019-DARPA researchers are trying to find improvements by reducing signaling energy and latency, while increasing overall signaling capacity and component density. This is where the PIPES project comes in.
Developing efficient, high-bandwidth, package-level photonic signaling should have substantial influence on high-performance computing, on big-data applications that use machine learning, advanced sensors, and wireless interfaces.
While optical signaling is common today in such systems at the board and rack levels, it has not yet been integrated within component switch chips, central processing units (CPUs), and graphical processing units (GPUs).
Jamie Whitney, Associate Editor