CIN::APSE solderless high-density stacking interconnects are for applications where designers use a mezzanine board layout to reduce space and weight.
The 1-millimeter pitch accommodates high-density circuits between boards. The CIN::APSE mechanical contacts are durable for applications that require several cycles of disconnections for modifications or testing.
The mechanical contacts also reduce the need for soldering and subsequent inspection.
For more information contact Cinch Connectivity Solutions online at www.belfuse.com/cinch.
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