Molex introduces Impact zX2 backplane connector system to meet high-speed data demands

LISLE, Ill. Molex in Lisle, Illinois, is introducing the Impact zX2 backplane connector system, designed to help data communications (datacom) equipment developers meet steadily increasing data rate requirements and the demand for faster and faster systems.

Molex introduces Impact zX2 backplane connector system to meet high-speed data demands
Molex introduces Impact zX2 backplane connector system to meet high-speed data demands

LISLE, Ill.Molex in Lisle, Illinois, is introducing the Impact zX2 backplane connector system, designed to help data communications (datacom) equipment developers meet steadily increasing data rate requirements and the demand for faster and faster systems.

Moleximpactzx2 1Moleximpactzx2The new Molex backplane connector system enables users to upgrade their line cards to meet ever-increasing data rate requirements without making major revisions to their existing infrastructure, officials say. “The zX2 system is backward compatible with standard Impact headers, allowing current Impact customers to keep their existing architecture in place while upgrading their chassis’ data rates.”

Molex introduces Impact zX2 backplane connector system to meet high-speed data demandsMolex introduces Impact zX2 backplane connector system to meet high-speed data demands

The Impact zX2 supports data rates of up to 28 gigabits per second (Gbps) in a modular design, and uses Impel patented ground shielding and footprint technology to enhance signal integrity (SI) performance.

“The Impact Connector System was created to enable customers to design-in a high-density connector solution; with Impact zX2’s optimized signal integrity performance and ability to support more aggressive channel loss requirements, customers can extend the life of their Impact chassis,” says Liz Hardin, global product manager, Molex.

A common-ground structure improves crosstalk isolation, resulting in increased near-end crosstalk (NEXT) margin. Tuned to lower functional impedance to 95 Ohms, discontinuities are minimized throughout signal channels. Reduced-size compliant pins (0.36mm) on both the backplane and daughter card modules optimizes printed circuit board (PCB) footprint, which helps to further enhance the SI performance of the connector system by reducing impedance in the footprint.

The Impact upgrade, Impact zX2, is well suited to applications in data/computing, aerospace and defense, telecommunications, and medical.

Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, medical, industrial, automotive, and commercial vehicle.

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