VORAGO Technologies delivers system-in-package prototypes to NASA
VORAGO has developed SIP technology that integrates multiple radiation-hardened die and are now qualifiying the SIP device for space flight.
AUSTIN, Texas — VORAGO Technologies, a provider of radiation-hardened embedded systems technology, has delivered prototype samples and evaluation kits to NASA as part of an ongoing NASA Small Business Innovation Research (SBIR) Phase II grant by the National Aeronautics and Space Administration (NASA).
The System-In-Package (SIP) is optimized for size, weight, power consumption and radiation hardness.
As spacecraft technology is continually miniaturized to reduce size, weight and power consumption, it is becoming increasingly challenging for designers to implement advanced system functionality into a tiny form factor. VORAGO has developed SIP technology that integrates multiple radiation-hardened die and are now qualifiying the SIP device for space flight. The SIP implementation is five times smaller than an equivalent circuit that utilizes conventional discrete ICs.
“We are delighted to have produced prototype SIP devices with hardware and software development tools,” said Bernd Lienhard, chief executive officer at VORAGO Technologies. “Our next step is to follow the MIL-PRF-38534 class K qualification flow to provide flight units to NASA.” Several NASA Centers are currently evaluating the prototype units for future missions.