ACT offers cooling solution for high power electronics with AlSiC plate and heat pipes

LANCASTER, Pa., 15 June 2009. Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing an aluminum silicon carbide (AlSiC) electronics cooling plate for cooling high power electronics in aircraft avionics and space electronics applications.

LANCASTER, Pa., 15 June 2009. Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing an aluminum silicon carbide (AlSiC) electronics cooling plate for cooling high power electronics in aircraft avionics and space electronics applications.

The HiK AlSiC plate has embedded heat pipes to achieve typical thermal conductivity ranges from 500 to 800 W/m-K, depending on the plate dimensions and heat source profiles.

By controlling the composition of aluminum and silicon carbide, the coefficient of thermal expansion (CTE) of the HiK AlSiC plate can be tailored to match that of the electronic device, which allows direct attachment of the electronic device to the HiK plate to eliminate the need for stress compensating thermal interface materials and consequently reducing the thermal interface resistance.

Traditional aluminum and AlSiC plates have thermal conductivities of 180W/m-K and 200W/m- K, respectively. Embedding heat pipes in the plate increases the thermal conductivity by several factors, without compromising its mass, strength or corrosion resistance.

The low density of AlSiC makes it suitable for cooling portable/hand held devices, avionics and spacecraft payloads. Potential applications include: IGBT heat spreaders, antenna enclosures, microprocessor heat spreaders/sinks, and high power lasers and LEDs.

For more information contact ACT online at www.1-act.com.

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