AUSTIN, Texas.VORAGO Technologies, a provider of radiation-hardened (rad-hard) and extreme-temperature embedded systems technology, in Austin, Texas, won a Small Business Innovation Research (SBIR) Phase II grant by the National Aeronautics and Space Administration (NASA) to continue designing a radiation-hardened miniaturized system-in-package (SIP) optimized for size, weight, and power consumption (SWaP) as well as radiation hardness.
The project now underway is consistent with VORAGO’s technology expertise and an extension of the successful phase I effort, officials say.
As spacecraft technology continues to be miniaturized to reduce size, weight, and power consumption, it is increasingly challenging for designers to implement all the required system functionality into a progressively smaller form factor.
VORAGO is developing SIP technology that integrates multiple radiation-hardened die and that will be qualified for space flight. The SIP implementation is five times smaller than an equivalent circuit that uses conventional discrete integrated circuit (ICs).
“We are delighted that NASA continues to recognize and support our unique capability in developing innovative technology for space,” explains VORAGO Technologies Chief Executive Officer Bernd Lienhard. “We believe VORAGO’s HARDSIL radiation hardening technology and our ability to optimize size, weight, and power consumption will enable the next generation of spacecraft.”
VORAGO Technologies is a privately held, high-tech company based in Austin, Texas, with patented and proven solutions that enable electronics systems for extreme temperature and radiation environments.
VORAGO’s patented HARDSIL technology uses cost-effective, high-volume manufacturing to harden any commercially designed semiconductor component for extreme environment operation. “VORAGO Technologies opens up a new world of possibilities for your designs, no matter how hostile the environment,” officials say.